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XC7V585T-3FFG1157E
Manufacturer Part Number:
XC7V585T-3FFG1157E
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Ihs Manufacturer:
XILINX INC
Part Package Code:
BGA
Package Description:
FBGA-1157
Pin Count:
1157
Reach Compliance Code:
compliant
ECCN Code:
3A991.D
HTS Code:
8542.39.00.01
Manufacturer:
Xilinx
Risk Rank:
5.79
Clock Frequency-Max:
1818 MHz
Combinatorial Delay of a CLB-Max:
0.58 ns
JESD-30 Code:
S-PBGA-B1157
JESD-609 Code:
e1
Length:
35 mm
Moisture Sensitivity Level:
4
Number of CLBs:
45525
Number of Inputs:
600
Number of Logic Cells:
582720
Number of Outputs:
600
Number of Terminals:
1157
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-55 °C
Organization:
45525 CLBS
Package Body Material:
PLASTIC/EPOXY
Package Code:
BGA
Package Equivalence Code:
BGA1156,34X34,40
Package Shape:
SQUARE
Package Style:
GRID ARRAY
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Power Supplies:
1,1.8 V
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status:
Not Qualified
Seated Height-Max:
3.35 mm
Subcategory:
Field Programmable Gate Arrays
Supply Voltage-Max:
1.03 V
Supply Voltage-Min:
0.97 V
Supply Voltage-Nom:
1 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
MILITARY
Terminal Finish:
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Width:
35 mm